We are developing the key leading edge high speed Physical Layer Interfaces as well as different Interface and memory IP subsystems for Intel products. We offer you to be part of a development team which ambitiously contribute to shaping and driving the future of the next mobile communication solutions.
We are looking for a talented, open-minded student with a technical background in digital design, simulation and verification of advanced digital High Speed Interface circuits in deep-submicron CMOS technologies.
Your responsibilities will include:
Inside this Business Group
The Platform Engineering Group (PEG) is responsible for the design, development, and production of system-on-a-chip (SoC) products that go into Intel’s next generation client and mobile platforms. PEG strives to lead the industry moving forward through product innovation and world class engineering.
The candidate will work in a multicultural, multisite environment and besides mastering the mentioned technical skills, (s)he must have project team spirit, engagement, communication skills and clear orientation to results
|Anzeigenart||Praktikum, Werkstudent, Abschlussarbeiten|
|Berufliche Praxis||keine Angabe|
|Aus- und Weiterbildung||Abschluss Hochschule / Berufsakademie / Duales Studium|
|Berufskategorie||Informationstechnologie, Softwareentwicklung / Web- und Screendesign|
|Arbeitsort||Dornacher Str. 1, 85622 Feldkirchen/München|
Intel Deutschland GmbH