Senior RF Circuit Design Transceiver (f/m) /Job ID: JR0015517

Feldkirchen/München
Intel Deutschland GmbH

Job ID: JR0015517

Senior RF Circuit Design Transceiver (f/m)

Job Description

Creating and extending computing technology to connect and enrich the lives of every person on Earth--that's our vision, is it yours? We are changing the world at Intel. Step inside our world and you will find one brilliant mind after another - current and future leaders - all working together in a spirit of collaboration that is simply contagious.

 

RF Engineers are responsible for RF topology selection and design, RF system analysis, RF system block characterization and specification. In addition, RF engineers operate radio frequency test equipment and are responsible for the design of RF circuits per specifications, simulations and analysis of RF circuits. Understanding of analogue circuits, characterization of boards and understanding/defining chip layout requirements.

 

So this is a true end to end responsibility, from specification until customer ramp. Therefore your responsibilities as Senior RF Circuit Design Transceiver (f/m) will include but will not be limited to:


  • Development of functional radio frequency circuit blocks for RF application.
  • Observance of the specification under consideration of testability and tolerances of the production.
  • Dimensioning and verification of the circuit blocks with use of the IMC development tools.
  • Check of the generated layout for RF-suitability.
  • Introduction and support of the test engineer for the test concept.
  • Circuit and circuit block evaluation with RF lab test equipment.
  • Error analysis, redesign and optimization.
  • Design-in support for the customer if necessary.
  • Transfer of the circuit to the fab and observation of the production yield during the ramp-up phase.
  • Analysis of production yield problems and correction with redesign if necessary.

 

What we offer you:

  • We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth.
  • Have a chance to participate in Intel Great Place to Work program which groups people who love running, cycling, squash, tennis, cross fit, photography, and many, many more
  • Chill out with unlimited amount of coffee, tea, and soft drinks
  • Charge internal batteries during energetic team events
  • We offer a competitive salary and financial benefits such as bonuses, retirement plans, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation).
  • We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs and amenities, flexible work hours, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work!


We're constantly working on making a more connected and intelligent future, and we need your help. Change tomorrow. Start today.


Inside this Business Group

Intel is one of the largest suppliers of chips for the communications market. The Intel Communications group is focused on designing and building communications technologies such as Ethernet connectivity products, optical components, communications processing solutions and broadband products.


Voraussetzungen

Qualifications


Must have

  • Bachelor or Master of Science degree in Electrical Engineering
  • 3 - 5 years experience in RF or analogue integrated CMOS circuit design
  • Solid experience with development tools Cadence and software development
  • Profound knowledge of floor planning and power supply concepts
  • Knowledge of computer automated RF lab measurement techniques. 
  • Basic knowledge of modelling of RF devices RF transistor models, inductors, capacitance etc. and implementation in CAD tools 
  • Basic knowledge of test development for front-end and backend
  • Demonstrated strong commitment to teamwork
  • Strong communication skills with the ability to work with cross-functional teams
  • Excellent analytical and problem solving skills
  • Fluent technical English language skills 


Nice to have

  • Basic knowledge of chip manufacturing process 
  • Basic knowledge of technologies and CMOS processes
  • Basic knowledge of package and packaging processes
  • Basic knowledge of package models• Fundamentals in Envelope tracking technique welcome
  • German language knowledge skills are an advantage.

Kontakt für Bewerbung

Germany Hiring

Arbeitsort

Dornacher Str. 1, 85622 Feldkirchen/München

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