Senior PMIC/Envelope Tracking Chip Architect (m/f) /Job ID: JR0020433

Feldkirchen/München
Intel Deutschland GmbH

Job ID: JR0020433

Senior PMIC/Envelope Tracking Chip Architect (m/f)

Job Description


Your will be responsible for the definition of envelope tracking solutions for RF PAs.


Your main tasks will be to:

  •  Define, align and break down the product requirements
  •  Define the ETIC architecture and its operation with the RF transceiver and RF frontend components
  •  Trade and track performance, cost, PCB area KPIs
  •  Write product specifications for design teams, SW and validation teams
  •  Estimate product chip size and cost
  •  Contribute to the roadmap definition
  •  Drive innovation and new IP development projects
  •  Define the IP and component verification plan
  •  Lead the system integration and validation
  •  Support the customer design-ins and act as one of the key technical counterparts for the customers

 


Inside this Business Group

The Mobile and Communications Group delivers the next generation of smartphones, tablets, feature phones, and connected devices with leading-edge technologies. MCG is chartered with providing optimal hardware, software, and connectivity ingredients for mobile devices and complete system solutions that deliver compelling user experiences and delight both consumers and business professionals.

Voraussetzungen

Qualifications-


  • Technical expert Ph.D. / Master / Degree in Electrical/Electronic Engineering in RF and power management
  • At least 10 years experience in system/concept engineering or system integration
  • Deep understanding of RF and PA requirements- RF experience in general with strong focus on Transmit
  • Knowledge in 3GPP cellular standard- Very good team work and communication skills
  • Strong analytical and problem solving skills- Proactive and autonomous working ability
  • Fluent in both spoken and written English- Fluent in German is beneficial
  • Verification methodology 


Good knowledge in at least 3 of the following areas:

o Mobile platform architecture and components o Power Management for portable devices o Cellular RF 2G/3G/4G o Envelope Tracking o High Bandwidth DCDC o RF performance measurements o Digital Signal Processing e.g. distortion


Kontakt für Bewerbung

Germany Hiring

Arbeitsort

Dornacher Str. 1, 85622 Feldkirchen/München

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Anzeigenart Stellenangebot
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Vertragsart Festanstellung
Berufliche Praxis mit Berufserfahrung
Aus- und Weiterbildung Abschluss Hochschule / Berufsakademie / Duales Studium
Berufskategorie Informationstechnologie, Softwareentwicklung / Sonstiges
Arbeitsort
Dornacher Str. 1, 85622 Feldkirchen/München